Destructive Physical Analysis (DPA)

It’s a detailed examination of EEE components at various stages of physical disassembly. This test has the target to verify that the component quality is in accordance with the detailed project requirements. In a DPA test, components are examined for a wide variety of design and processing problems that may not show up during the previous inspection, test and screening activities performed by the component manufacturer. Defects and problems which are detected through DPA test could cause failure of the system. This test is conducted on samples taken randomly from the lot and include a series of different tests and inspections depending on the type of the component.

DPA test involves:
- External Visual Inspection
- X-ray Examination
- Solderability
- Lead Integrity
- Seal tests (Fine and Gross leaks)
- PIND test (Particle Impact Noise Detection)
- Internal Visual Inspection
- Scanning Electron Microscope (SEM) Inspection
- Bond Pull
- Die Shear

Available standards (e.g. ASTM, MIL): ESCC 21001, MIL-STD-750, MIL-STD-1580, MIL-STD-883, SSQ 25000-Destructive Physical Analysis, NASA PEM-INST-001
ISO/IEC 17025
ISO 9001
Keywords: DPA, Destructive Physical Analysis, Component Analysis, EEE parts