Destructive Physical Analysis (DPA)

Is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements.

In a DPA parts are examined for a wide variety of design, manufacturing, workmanship, and processing problems which may not observed in previous inspection stages.

DPA is conducted on samples randomly selected from the lot and consists of a series of various tests and inspections depending on the component type and package style. Among others, typical test are::

 - X-ray Examination
 - External Visual Inspection
 - Seal tests (Fine& Gross leaks)
 - Particle Impact Noise Detection (P.I.N.D)
 - Solderability
 - Internal Visual Inspection
 - Bond Pull
 - Scanning Electron Microscope (SEM)
 - Die Shear