CSAM - Inspection

Scanning Acoustic Microscopy (SAM), a consolidated and recognized tool for quality control, inspection and failure analysis of microelectronic components and materials. This inspection technique is routinely used for the non-destructive detection of internal anomalies (cracks, voids and delamination, porosity, hermeticity issues…).


• Scanning Acoustic Microscopy. Confocal inspection.
• Multi-focal imaging.
• Thought transmission ultrasound inspection.
• A-scan, peak amplitude and phase inversion analyses. 
• Detection of micrometric features of submicrometric 
• Depth mapping.
• Non-destructive visual crossectioning.
• Fourier transform data treatment.
• Post-inspection moisture removal.

Used Standards and Test methods:

• Plastic encapsulated systems
     PC/JEDEC J-STD-020E (Moisture Sensitivity level)
     IPC/JEDEC J-STD-035
     ESCC25200 (Space level)
     NASA PEM-INST-001 (Space level)
     MIL-STD-1580 (Military level)
• Chips on board and post-soldering verification
     GEIA-STD-0006
• Ceramic capacitors  
     MIL-PRF-123 ,  MIL-PRF-31033,   MIL-PRF-49470
 •    Hermetic packages
     Die attach and lid-seal inspection
 •    ...., etc. 
ISO/IEC 17025
ISO 9001
Keywords: CSAM, Acoustic Inspection, ultrasound

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