Die Shear test
Die shear testing is recommended to investigate the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates.
The knowledge of RGM SPACE Team in addition to the state-of-the-art technology equipment are essential to perform this kind of test.
Die Shear Testing is a step of DPA - Destructive Physical Analysis process performed by RGM SPACE Laboratory.
Keywords: Die Shear Test, eee parts, engineering