Die integration in Ball Grid Array Package (BGA) available for small and mid volume production in SERMA MICROELECTRONICS. All operations (IC substrate design and technoloy selection, die attach, bonding, molding) are done in our facility in La Rochelle (France). Environmental test results available upon request (thermal cycling, MSL3, ...). Various options available and customised depending ont the die format and mission profile.
Experience on BGA121 , BGA256, BGA272, BGA361, BGA512