Die integration in Ball Grid Array Package (BGA) available for small and mid volume production in SERMA MICROELECTRONICS. All operations (IC substrate design and technoloy selection, die attach, bonding, molding) are done in our facility in La Rochelle (France). Environmental test results available upon request (thermal cycling, MSL3, ...). Various options available and customised depending ont the die format and mission profile.
Experience on BGA121 , BGA256, BGA272, BGA361, BGA512
Type:
Service
Available standards (e.g. ASTM, MIL):
MIL / ECSS
Project heritage:
space and defence
Cleanroom classes (ISO 14644-1):
ISO Class ≤5
ISO Class 6
ISO Class 7
ISO Class 8
ISO Class 9
Certification:
ISO/IEC 17025
ISO 9001
AS/EN/JISQ 9100
Keywords:
BGA Ball Grid Array
