3D X-ray (CT-scan) on EEE parts Advanced

ELEMCA provides CT-scan (computed tomography: 3D X-ray imaging) on a wide array of EEE devices: semiconductor components (MEMS, sensors, discrete), passives, assembled boards and integrated module.

Your needs
- defect localization (check our turn-key solution for Failure analysis https://triasrnd.com/en/l/418-failure-analysis )
- integrity verification (solder joints, package sealing, die attach, internal wire-bonding...)

Our NDT engineers & technicians team use a very high-resolution CT-scanner (RX solutions), tailor-made for semiconductor components and chips.

key features
ultimate resolution < 5┬Ám
laminography mode (for large PCBA)

Our space industrial customers (OEMs, payload suppliers), EMS and semiconductor IDMs appreciate ELEMCA key advantages:
-cost-competitive rates
-clear localization of potential defects

warning EEE parts exposure to X-ray may induce unexpected faults, especially on discrete components and ICs.

Project heritage: Space authorities (CNES, ESA) + major OEMs (AIRBUS DEFENCE & SPACE, LEONARDO, SODERN, THALES ALENIA SPACE)
ISO/IEC 17025
ISO 9001
Keywords: CT-scan, Computed tomography, micro-tomography, RX, RX3D, defect localization, , Elemca, Toulouse, France