ELEMCA provides DPA and construction analyses on EEE devices: semiconductor components (MEMS, sensors, discrete), passives and assembled boards.
Your needs
- benchmark / competitive analysis (reverse engineering)
- quality process control
For failure analysis cases, please consult our dedicated solution on TriasRnD: https://triasrnd.com/en/l/418-failure-analysis
Our PhD & engineers team applies a top-down protocol, to extract all the relevant data you may expect: materials, geometry, technological weaknesses…
ELEMCA workflow: Construction analysis
Electrical tests: actual performances at room temperature or under environment (thermal, climatic, vacuum)
External visual overview
Non-destructive localization of key functions (chips, sensing element, interconnects…), by 3D X-ray Computed Tomography
Access to the area of interest: package opening or microsection
Physical & chemical inspection (SEM, TEM): layer-by-layer analysis, geometry…
Our space industrial customers (OEMs, payload suppliers), EMS and semiconductor IDMs appreciate ELEMCA key advantages:
-fast-delivery
-cost-competitive rates
-high-end analysis tools for electronic imaging and surface + in-depth analyses
