Construction analysis & DPA Advanced

ELEMCA provides DPA and construction analyses on EEE devices: semiconductor components (MEMS, sensors, discrete), passives and assembled boards.

Your needs
- benchmark / competitive analysis (reverse engineering)
- quality process control
For failure analysis cases, please consult our dedicated solution on TriasRnD:

Our PhD & engineers team applies a top-down protocol, to extract all the relevant data you may expect: materials, geometry, technological weaknesses…

ELEMCA workflow: Construction analysis
Electrical tests: actual performances at room temperature or under environment (thermal, climatic, vacuum)
External visual overview
Non-destructive localization of key functions (chips, sensing element, interconnects…), by 3D X-ray Computed Tomography
Access to the area of interest: package opening or microsection
Physical & chemical inspection (SEM, TEM): layer-by-layer analysis, geometry…

Our space industrial customers (OEMs, payload suppliers), EMS and semiconductor IDMs appreciate ELEMCA key advantages:
-cost-competitive rates
-high-end analysis tools for electronic imaging and surface + in-depth analyses

Project heritage: Space authorities (CNES, ESA) + major OEMs (AIRBUS DEFENCE & SPACE, LEONARDO, SODERN, THALES ALENIA SPACE)
ISO/IEC 17025
ISO 9001
Keywords: DPA, destructive physical analysis, construction analysis, technological analysis, process control, reverse engineering, Elemca, Toulouse, France