Failure Analysis is the process of analysing the component to find out the reason for degradation or failure of a EEE component, during component manufacturing and testing, during incoming inspection or after delivery to the client. Thanks to Failure Analysis is possible to understand how and when the failure occurred.
Failure Analysis test is composed of some subtests:
- Visual Inspection
- Electrical test
- Thermal Analysis
- SEM/EDX Investigation and Microsection