To be able to predict not only the temperature distribution in a component made of one material but also in systems made of different materials, structures and interfaces, the heat transfer in the relevant interfaces must also be determined.
With our thermal contact conductance setup, the heat conduction of mechanical interfaces can be characterized. Heat transfer depending on materials, surface condition, environment and interlayer material as well as the influence of homogeneous surface pressure versus typical screwed connection can be examined.
An electrical heater and a cooled heat sink generate a temperature difference. Parallel heat flux is reduced with baffles.
Application:
• thermal contact conductance
• thermal contact resistance
• influence of surface conditions and environment
• influence of homogeneous surface pressure versus screw pattern
Device under test:
• any combination of materials
• interlayer material such as adhesives
• screw connections
