HCM.SYSTREL defines and provides manufacturing processes to integrate dies in SCM (Single Chip Modules), MCM (Multi Chip modules), hermetic hybrids, SiP (System in Package) on both ceramics or organics substrates.
Various processes available upon request for:
Die attach
- Adhesive (conductive, insulating)
- Eutectic
- Soft solder
- Silver sintering
Wirebonding
- Wedge bonding (Al/Au 17 to 75 µm)
- Ball bonding (Au 17 to 75µm, Cu 25µm)
- Heavy wire bonding (Al 125 to 500 µm)
- Cu/Pd
- Flip chip
Sealing
- AuSn sealing
- Seam welding
- Epoxy or silicon Globe top
- Silicon Gel casting
- Adhesive Glass lids
Project heritage:
30 years experience, flight heritage
Cleanroom classes (ISO 14644-1):
ISO Class ≤5
ISO Class 6
ISO Class 7
ISO Class 8
ISO Class 9
Certification:
ISO/IEC 17025
ISO 9001
AS/EN/JISQ 9100
Keywords:
assembly house microelectronics die
