Wafer sawing services available
- up to 12 inches sawing machines
- Wafer mounting on adhesive/UV films on frames
- De-ionized water station/CO2 Bubbler
- Materials: Si, GaAs, Ceramic, Glass, Sapphire, SiC, GaN, etc..
- Loading in waffle packs / gel packs
Project heritage:
30 years experience
Cleanroom classes (ISO 14644-1):
ISO Class ≤5
ISO Class 6
ISO Class 7
ISO Class 8
ISO Class 9
Certification:
ISO/IEC 17025
ISO 9001
AS/EN/JISQ 9100
Keywords:
dicing wafer sawing disco machine
