In 2012, HCM.SYSTREL (SERMA GROUP) has been awarded a contract from ESA to develop a european column attachment process in its facility in La Rochelle (France). This process, today available, includes the in house operations of columns manufacturing, lands de-golding and tinning, column soldering on substrate, quality control and coplanarity measurement (using contactless metrology microscope). This process is also available for reworking columned packages.
Characteristics
-Package pin count: Up to 1752
-Package Lands Diameter: 0.68 and 0.86 mm
-Package Body Size: Up to 45x45mm
-Packages Pitches : 0.80 – 1.00 – 1.27mm
-Coplanarity < 150 μm
-Columns Pull-test vs MIL-STD-883 Method 2038: >320gr
PID available upon request
Project heritage:
process validated by ESTEC and flight models produced
Cleanroom classes (ISO 14644-1):
ISO Class ≤5
ISO Class 6
ISO Class 7
ISO Class 8
ISO Class 9
Keywords:
Column Grid Array CGA CCGA
