Wafer sawing

Wafer sawing services available

  • up to 12 inches sawing machines
  • Wafer mounting on adhesive/UV films on frames
  • De-ionized water station/CO2 Bubbler
  • Materials: Si, GaAs, Ceramic, Glass, Sapphire, SiC, GaN, etc..
  • Loading in waffle packs / gel packs
Project heritage: 30 years experience
Cleanroom classes (ISO 14644-1):
ISO Class ≤5
ISO Class 6
ISO Class 7
ISO Class 8
ISO Class 9
ISO/IEC 17025
ISO 9001
Keywords: dicing wafer sawing disco machine

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