Column attachment services

In 2012, HCM.SYSTREL (SERMA GROUP) has been awarded a contract from ESA to develop a european column attachment process in its facility in La Rochelle (France). This process, today available, includes the in house operations of columns manufacturing, lands de-golding and tinning, column soldering on substrate, quality control and coplanarity measurement (using contactless metrology microscope). This process is also available for reworking columned packages.

Characteristics

-Package pin count: Up to 1752

-Package Lands Diameter: 0.68 and 0.86 mm

-Package Body Size: Up to 45x45mm

-Packages Pitches : 0.80 – 1.00 – 1.27mm

-Coplanarity < 150 μm

-Columns Pull-test vs MIL-STD-883 Method 2038: >320gr

PID available upon request

Project heritage: process validated by ESTEC and flight models produced
Cleanroom classes (ISO 14644-1):
ISO Class ≤5
ISO Class 6
ISO Class 7
ISO Class 8
ISO Class 9
Keywords/tags: Column Grid Array CGA CCGA

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